Kester Flux-Pens®

The Kester Flux-Pen® is a unique tool for rework and touch-up soldering. It allows controlled applications of flux, eliminating the mess from flux bottles. The Flux-Pen® is ideally suited for surface mount rework, component add-on applications, and TAB assembly operations. The available formulas are listed in the chart below.

 
No-Clean
Water-Soluble
Formula
952-D6
186-18
Flux Type
Low Solids
Low Solids
Rosin Mildly Activated (RMA)
Rosin Mildly Activated (RMA)
Neutral pH
Lead-Free Compatible No Yes Yes Yes Yes
Product characteristics Very low solids, resin free, practically no residue after the soldering process. A non-corrosive, halide free liquid flux that is specifically designed for the wave soldering and rework of conventional and surface mount curcuit board assemblies. This comprehensive formulation exhibits excellent wetting characteristics and has superior corrosion inhibiting properties. Provides a non-tacky residue. Suitable for foam or spray fluxing applications. Designed for high thermal stability and superior solderability. Military approved formula for add-on and rework applications. Percent solids (typical): 36 Designed for high thermal stability and superior solderability. Military approved formula for add-on and rework applications. Percent solids (typical): 36 Neutral pH for wave solder flux user who has additional add-on and rework applications.
Residue removal method Not normally required. May be removed with hot de-ionized water at 60-71°C (140-160°F) with 1% solution of Kester's 5768 Bio-Kleen®. Not normally required. Not normally required. May be removed by solvent or Kester's 5768 Bio-Kleen® saponifier at 7-10% solution in de-ionized or soft water at 49-60°C (120-140°F) Not normally required. May be removed by solvent or Kester's 5768 Bio-Kleen® saponifier at 7-10% solution in de-ionized or soft water at 49-60°C (120-140°F) Residue removal is required. Use soft or de-ionized water at temparatures of 49-65°C (120-150°F).
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